Qualifications

• Qualification & Experience:
  
• 1. Diploma in Engineering with min 3 years relevant working experience.
  
• 2. Must possess good knowledge in Die Attach and Wire Bond process involving multi-die stack
  
• technology (up to 16 die-stack) in memory product manufacturing.
  
• 3. Experience in handle thin die until 1.2mils die thickness
  
• 4. Experience in handle multi type of stack bonding.
  
• 5. A self-starter, hands-on person and willing to multi task and to take additional responsibilities.  
  
• 6. Practical experiences with all the equipment’s in process and maintenance.
  
• Education Requirement:
  
• Diploma in Electrical/Electronic/Mechanical/Mechatronics Engineering.
  
• Additional Desirable Qualifications:
  
• Hands-on experience on below equipment types:
  
• a) Die-Attach (ASM, ESEC, ISTACK, Fastfort)
  
• b) Wire-Bond (K&S ICONN+, K&S ICONN and K&S MAXUM)