JobsConnect Manpower Agency Inc.

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1. Responsible for Die Prep/ Die Attach process and equipment as demonstrated by the yield, quality,
reliability performance of all customer products.
2. Drive equipment capability, upgrading/modernization, sustainability, equipment efficiency & stability
3. Knowledge and exposure in wafer backgrind ,dicing, AOI, die attach, hands-on in Disco/ Okamoto/ASM/
ESEC equipment and troubleshooting is a must.
4. Drive, establish and implement process simplification/optimization programs/ process &equipment
automation projects to improve yield, quality, lead time & cost
5. Drive cost saving projects through improve & qualify new cost effective factory supplies and indirect
material, factory supplies usage/wastage of reduction to meet Finance cost/sale target.
6. Manage of spare parts for equipment and repair of damage parts.
7. In charge of customer accounts to provide solution on technical difficulties/new technologies challenges,
business review, calibrate new products & technology roadmap.
8. Lead in knowledge GURU programs, to up-skill workforce productivity & agility.
9. Any other duties assigned from time to time.

Qualification & Experience:
1. Degree in Engineering with min 5-6 years relevant working experience.
2. Must possess strong knowledge in Die-Attach process involving multi-die stack technology
(up to 16 die-stack) in memory product manufacturing.
3. A self-starter, hands-on person and willing to multi task and to take additional responsibilities.
4. Strong management skill, aggressive, result oriented with the ability to work under pressure.
5. Strong in leadership, problem solving, continuous improvement.
6. Practical experiences with all the equipment’s in die prep process and maintenance.
7. Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, preventive
maintenance.
8. Hands-on experience in Die-Attach (ASM, ESEC, ISTACK) and Die-Sort (Laurier, Muehlbauer, Teltec)
equipment.